Product Type:Interface Module Backplane
Exhibitors:Honeywell
Model Number:8C-TAIDB1/51307133-175
Weight (kg):0.56
Size (mm):160 x 100 x 50
Operating Temperature (°C):-20 to +70
Storage Temperature (°C):-40 to +85
Operating Humidity (%):5 to 95 non-condensing
Input Voltage (V):24 VDC
Output Current (A):5 A
Connection Type:DB9 Connector
Communication Protocol:RS-485, Modbus
The Honeywell 8C-TAIDB1/51307133-175 Interface Module Backplane is specifically engineered to enhance the performance of industrial control systems. Its robust design ensures reliability in harsh environments, making it ideal for use in manufacturing, process control, and automation applications.
Equipped with a wide range of input/output channels, this backplane allows for flexible and efficient data exchange between different components of an industrial system, optimizing operational efficiency.
With support for Modbus RTU protocol, the module facilitates seamless communication between various devices on the network, ensuring smooth data flow and reducing potential downtime.
Featuring a compact yet durable form factor, the 8C-TAIDB1 is easy to integrate into existing setups, minimizing installation time and costs. Its wide temperature range compatibility ensures reliable operation across diverse industrial settings.
Compliance with international safety and certification standards (CE, UL, FCC) guarantees the module meets global regulatory requirements, providing peace of mind for users and ensuring compatibility with a wide range of systems.
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